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Tungsten Copper

What is tungsten copper?

Tungsten Copper Alloy (Copper Tungsten, CuW, or WCu) is a pseudo-alloy of copper and tungsten. As copper and tungsten are not mutually soluble, the material is composed of distinct particles of one metal dispersed in a matrix of the other one. The microstructure is therefore rather a metal matrix composite than a true alloy.

The alloy combines the properties of both metals, resulting in a material that is heat-resistant, ablation-resistant, highly thermally and electrically conductive, and easy to machine.Parts are made from the WCu alloy by pressing the tungsten particles into a desired shape, sintering the compacted part, then infiltrating with molten copper. Sheets, rods and bars of the alloy are available as well.

Using CIP formation, sintered tungsten skeleton and infiltrating copper (silver) technology, large size and special shape products of WCu composites with 6-90 percent of copper are produced, such as electric contacts, electrode, refractory parts, heat sinks and parts of rocket, We can also produce WCu alloy sheet material, tubing, plate and other small products by mould pressing, extrusion pressing and MIM.

tungsten copper   tungsten copper

Specifications of WCu Alloy:

Code No.

Chemical Composition %

Mechanical properties

Cu

Impurity

W

Density
(g/cm3 )

 Hardness
HB

RES( cm)

 Conductivity
IACS/ %

 TRS/ Mpa

CuW(50)

50+2.0

0.5

Balance

11.85

115

3.2

54

 

CuW(55)

45+ 2.0

0.5

Balance

12.30

125

3.5

49

 

CuW(60)

40+2.0

0.5

Balance

12.75

140

3.7

47

 

CuW(65)

35+2.0

0.5

Balance

13.30

155

3.9

44

 

CuW(70)

30+2.0

0.5

Balance

13.80

175

4.1

42

790

CuW(75)

25+2.0

0.5

Balance

14.50

195

4.5

38

885

CuW(80)

20+2.0

0.5

Balance

15.15

220

5.0

34

980

CuW(85)

15+2.0

0.5

Balance

15.90

240

5.7

30

1080

CuW(90)

10+2.0

0.5

Balance

16.75

260

6.5

27

1160

 

If you have any interest in our products, please feel free to contact us by email: sales@chinatungsten.com or by telephone:86 592 5129696.


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